2015 Ethernet Technology Summit

Date: 
Tuesday, April 14, 2015 - 11:55am to Thursday, April 16, 2015 - 11:55am

Highlights

Three days packed full of seminars, forums, keynotes, and sessions:

  • Full-day forums on 40/100/400 GbE and Ethernet and SDN
  • Half-day forums on data center Ethernet, Ethernet and the Internet-of-Things, and Convergence
  • VC Forum, market research session, and shortest path bridging tutorial
  • Chat with the Experts

Instructions

During this application we will ask about your academic and work experience, and we'll also ask you some questions about your goals, interests, and why you want to participate in our internship program.

Information that you should have on hand before you start:

  • Your GPA
  • Classes you've taken in high school, with grades
  • Contact information for a previous employer (if you have prior work experience)
  • Contact information for two personal references

We've prepared a PDF preview of the application form with all of the questions and instructions: 2025 HighTech Bound Application Preview. Please note that we do not accept paper applications sent through the mail. The PDF version of the application is for reference only and the only way to apply for the HighTech Bound internship program is through this online form.

Please note: We are unable to offer UNH on-campus housing as part of the HighTech Bound program this year. 

Personal Information